Thermal expansion behavior of copper matrix composite containing negative thermal expansion PbTiO3 particles

Publication date: 15 October 2017
Source:Materials & Design, Volume 132
Author(s): J. Sheng, L.D. Wang, D. Li, W.P. Cao, Y. Feng, M. Wang, Z.Y. Yang, Y. Zhao, W.D. Fei
PbTiO3 ceramic exhibits large negative coefficient of thermal expansion in a wide temperature range. Here, we demonstrate that PbTiO3 particles is an effective filler to adjust the thermal expansion of copper matrix composite. The PbTiO3/Cu composites in the present study are prepared by spark plasma sintering method. The addition of PbTiO3 particles effectively reduces the coefficient of thermal expansion of the composite. The negative and decreasing thermal expansion of PbTiO3 particles suppresses the thermal expansion of Cu matrix with temperature increasing, which leads to low and stable coefficient of thermal expansion of the composite.

Graphical abstract

http://ift.tt/2uyD2Y9