Microstructure and chemical data of the thermoelectric ZnSb material after joining to metallic electrodes and heat treatment

Publication date: December 2017
Source:Data in Brief, Volume 15
Author(s): Safdar Abbas Malik, Le Thanh Hung, Ngo Van Nong
The data presented in this article are related to the research article entitled: "Solder free joining as a highly effective method for making contact between thermoelectric materials and metallic electrodes" (Malik et al., 2017) [1]. This article presents microstructure obtained by scanning electron microscopy (SEM) and chemical analysis by energy dispersive X-ray spectroscopy (EDX) point measurements of the thermoelectric ZnSb legs after joining to metallic electrodes using solder (Zn-2Al) and free-soldering methods.



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