Publication date: 5 May 2017
Source:Materials & Design, Volume 121
Author(s): Nachiketa Ray, Bernd Kempf, Gunther Wiehl, Timo Mützel, Frank Heringhaus, Ludo Froyen, Kim Vanmeensel, Jef Vleugels
Ag-WC (60-40wt%) contact materials based on three WC particle size powders were doped with 0.1wt% Ni and processed by an appropriate powder pre-treatment followed by spark plasma sintering (SPS). The contacts produced were already bonded to a copper profile during SPS in order to eliminate additional processing steps. The SPS composites had a more homogeneous microstructure and were tougher and softer than the materials produced by conventional press-sinter-infiltration. The infiltrated contacts had a lower arc-erosion whereas the contacts produced by both processes had a similar contact resistance. The microstructure after switching confirmed that the SPS materials had a porous contact surface layer and were crack-free in contrast to their press-sinter-infiltrated equivalents.
Graphical abstract
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